Abstract
Bishop and Associates has just released a new eight-Chapter research report analyzing Connector Imperatives to Support Next Generation Electronic Equipment. This new report identifies emerging electrical, mechanical and economic attributes of connectors anticipated by the electronic system design community as well as provide examples of new products connector suppliers have released or are developing in order to address these emerging needs. The report is focused on three industry segments that are experiencing the most rapid and dramatic changes, and represent some of the most fertile markets for innovation in connector technology (Computers, Telecom and Automotive). Statistics are presented showing historical and forecast connector shipments for the years 2005, 2006, 2007 and 2011.
The key objectives of this new report are to identify specific attributes of electronic connectors as reported by the connector using community, and to compare them with new development work as well as recently released connectors from the connector manufacturing industry. Product extensions of existing features as well as new capabilities are reviewed.
Some Of The Issues Explored In This Report
- Are connectors currently available on the market today capable of providing performance adequate to support systems for the foreseeable future?
- What new connector attributes or features will be required that may not exist today? When must these be in place? Will customers be willing to pay for these features?
- How has advanced transceiver chip technology enabled connectors to extend their design bandwidth?
- What role will emerging industry standards organizations and special interest groups play in influencing connector design, development and implementation in the future?
- Which electronic products or market segments are driving the need for higher connector performance? Why?
- What is the timetable required for new enhanced feature connectors to meet volume production requirements?
- What are the U.S. domestic, European, and Asian connector market values today and forecasts for connectors in the computer, telecom and automotive markets?
- Will new connector technologies being developed by small independent companies be able to influence system design using non-traditional interfaces or system packaging schemes?
- What are the greatest connector challenges now being faced by next generation system design engineers? What new products or technologies are connector users identifying as being critical to the successful development of their new systems?
- What new interconnect technologies now in the concept or development stage; have the potential to change traditional connector paradigms?
- Will contract manufacturers take over an increasing responsibility for actual system design? How will the use of EMS / ODMs in the manufacturing design process influence the migration of new interconnect technology into new systems? How will that change the OEM/connector vendor relationship?
- Is the plated through hole in a PCB reaching a high-speed performance limit? Will surface mounted connectors or some other technology become the high-speed PCB interface of choice?
- How must power connectors evolve in order to address the growing thermal management issue? What new products have been introduced to address these needs?
- Is the process by which new connectors are developed and introduced changing? How, why?
- How has the lead-free and other environmental initiatives influenced connector design, performance, and cost?
- Will new materials and manufacturing processes developed from nanotechnology play a significant role in next generation connector designs?
- How are connector manufacturers marketing their new interfaces given the movement of design engineering to offshore locations? How is technical support being provided on a global 24/7 basis?
- Is the connector-using community ready to make major paradigm shifts regarding interconnect technology and architecture?
- Which connector suppliers are perceived as leading the industry in new interconnect technology?
- How will connector companies protect their intellectual property as the manufacturing and design migration to offshore locations increases?
- How are leading connector companies responding to customer demand for a viable second source on all critical interconnects?
- How will the expansion of wireless technology influence the use of traditional copper connectors?
Table of Contents
Chapter 1 - Report Scope And Methodology
- Methodology and Approach
- Data Collection Forms:
- Connector Imperatives to support Next Generation Electronic Equipment
- Connector User
- Connector Imperatives to support Next Generation Electronic Equipment
- Connector Manufacturer
Chapter 2 - Introduction
Chapter 3 - Current Connector Technology
- Universal Attributes of Future Connectors
- Lead-Free Electronic Assemblies
- Complete Families of Connectors
- Multiple Sourced Connectors
- High-Speed Performance Headroom
- Accurate Performance Data and Models
- Renewed Interest In The Use Of Alternative Card Architecture Including Mezzanine
- And Midplane Configurations.
Chapter 4 - Connector Attributes, Computer, Telecom Markets
- Computer / Telecom Industry
- Connector Attribute: Increased Signal Density
- Connector Industry Response
- Increased Signal Density
- Computer / Telecom Industry
- Connector Attribute: Increased High-Speed Performance
- Connector Industry Response
- Increased High-Speed Performance
- Computer / Telecom Industry
- Connector Attribute: Improved Power Connectors
- Connector Industry Response
- Improved Power Connectors
- Computer / Telecom Industry
- Connector Attribute: Increased Connector Robustness
- Connector Industry Response
- Increased Connector Robustness
- Computer / Telecom Industry
- Connector Attribute: Standards Driven Interfaces
- Connector Industry Response
- Standards Driven Interfaces
- Computer / Telecom Industry
- Connector Attribute: Connectors Optimized for Orthogonal Midplanes
- Connector Industry Response
- Connectors Optimized for Orthogonal Midplanes
- Computer / Telecom Industry
- Connector Attribute: Improved Differential Skew Control
- Connector Industry Response
- Improved Differential Skew Control
- Computer / Telecom Industry
- Connector Attribute: High performance / Density Fiber Optic Connectors
- Connector Industry Response
- High performance / Density Fiber Optic Connectors
- Computer / Telecom Industry
- Connector Attribute: Increasing Use of Flex Interconnects
- Connector Industry Response
- Increasing Use of Flex Interconnects
Chapter 5 - Connector Attributes, Automotive
- Automotive Market
- Automotive Industry
- Connector Attribute: Compliant Pin, Surface Mount and Compressive PCB Termination
- Connector Industry Response
- Compliant Pin, Surface Mount and Compressive PCB Termination
- Automotive Industry
- Connector Attribute: Lower Mating Force Connectors
- Connector Industry Response
- Lower Mating Force Connectors
- Automotive Industry
- Connector Attribute: Greater Variety Of Consumer Accessible Interfaces
- Connector Industry Response
- Greater Variety Of Consumer Accessible Interfaces
- Automotive Industry
- Connector Attribute: Low Cost Filtered Connectors
- Connector Industry Response
- |Low Cost Filtered Connectors|
- Automotive Industry
- Connector Attribute: “Integrated Connectors”
- Connector Industry Response
- “Integrated Connectors”
- Automotive Industry
- Connector Attribute: Increased use of Shielded and Coaxial Connectors
- Connector Industry Response
- Increased use of Shielded and Coaxial Connectors
- Automotive Industry
- Connector Attribute: Fiber Optic Connectors
- Connector Industry Response
- Fiber Optic Connectors
- Automotive Industry
- Connector Attribute: Standards Driven Interfaces
- Connector Industry Response
- Standards Driven Interfaces
- Automotive Industry
- Connector Attribute: Hybrid Connectors
- Industry Response
- Hybrid Connectors
Chapter 6 - Additional Issues
- Protection Of Intellectual Property In The Global Marketplace
- Impact of Wireless Technology on Copper Interfaces
- Differential Impedance Changing From 100 to 85 ohms
- Global Migration of System Design
- Nanotechnology in Connector Fabrication
- Connectors With Integrated ESD Protection
- Non-Traditional Interfaces
- Connections to Non-Conventional Materials
Chapter 7 - Connector Market Values
- World Computer / Peripheral Connector Market By Geographic Region
- World Telecom / Datacom Connector Market By Geographic Region
- World Automotive Connector Market By Geographic Region
- Market Forecast by Region of the World
- Computer / Peripheral Connector Market Forecast
- Computer / Peripheral Connector Market Share by Region - 2006
- Computer / Peripheral Connector Market Share by Region - 2011
- Telecom / Datacom Connector Market Forecast
- Telecom / Datacom Connector Market Share by Region - 2006
- Telecom / Datacom Connector Market Share by Region - 2011
- Automotive Connector Market Forecast
- Automotive Connector Market Share by Region - 2006
- Automotive Connector Market Share by Region - 2011
Chapter 8 - Major Findings And Conclusions
- Computer and Telecom Markets
- Key ConsiderationsCost Drivers
- Compressive Connectors
- Resistance to Change
- Gb/s Performance
- Surface Mount
- Scalability
- Performance Headroom
- Orthogonal Midplane Connectors
- Industry Standards
- Technical Support
- Wireless Technology
- Connector Content Value
- Offshore Migration
- Connector Technical Support
- IP Protection
- Mezzanine Connectors
- Connector Support Tools
- Performance Comparison
- High-Speed Channel Metrics
- 85-Ohm Differential Impedance
- Increased Pin Density
- Automotive Market
- Key Consideration
- Expanding Electronic Applications
- EMI/ESD Connectors
- Compliant Pin & Surface Mount Termination
- Optic Connectors
- Second Source
- Consumer Interfaces
- Connector Integration
- General Observations
- Environmental Standards
- Industry Standards
- Flex Circuitry
- Nano Technology
- Second Source Imperative
- Emerging Markets
- Incremental Advances
- Continuing Trends
Appendix - Connector Definitions, Acronyms And Technologies
- Ambient Temperature
- Ampere
- Anti-pad
- ATCA
- Attenuation
- Bandwidth
- BGA
- Bit Error Rate
- Blindmate Connector
- BOM
- Breakdown Voltage
- Broadside Coupled
- Bulk Resistance
- Capacitance
- Characteristic Impedance
- Clearance Distance
- Conductivity
- Constriction Resistance
- Contact Resistance
- COTS
- Creepage Distance
- Crosstalk
- Current
- Current Rating
- DC
- D-to-D Converter
- De-emphasis
- Derating
- Dielectric
- Dielectric Constant
- Distributed Power Architecture
- Differential Signaling
- Dry Circuit Resistance
- Edge Coupled
- EMC
- EMI
- EMS
- EYE Patterns
- GBIC
- Heat Sink
- Hot Swap
- Inductance
- Insertion Loss
- Intersymbol Interference
- I/O
- Jitter
- Joule
- LAN
- LGA
- Loss Tangent
- MEMS
- Microstrip
- MSA
- N+1 Redundancy
- Normal Force
- ODM
- OEM
- Ohm
- Ohm' s law
- Operating Temperature
- Parallel Signaling
- PCB
- Power
- Propagation Delay
- PTH
- PICMG
- PMC
- Reflections
- Resistance
- Risetime
- RoHS
- S Parameter
- SERDES
- Serial Signaling
- SFP
- SIG
- Signal Integrity
- Single Ended Signaling
- Skew
- Skin Effect
- Smith Chart
- SPICE
- Stripline
- Supertemperature
- Surge / inrush current
- TDR
- Telematics
- Thermal Runaway
- Transmission Line
- VME
- VoIP
- Volt (V)
- Watt
- WiMax
