Abstract
Bishop and Associates has just released the new ten-chapter research report analyzing Power Connectors For The Computer And Communications Markets. This comprehensive report provides detail on all aspects of the computer and communication power connector market, including connector statistics by region, market, power rating and connector type the years 2005-2006 and 2011 (including five-year CAGRs).
Beyond detailing the factors that are driving the increase in power demand, this new report includes detailed data covering contact physics, power connector types, test methodology, the status of industry standards that define power connectors, as well as connector failure mechanisms. The issue of thermal management along with current and anticipated cooling options is discussed. A detailed review of existing as well as recently introduced power connectors from 17 leading suppliers is also included.
Market demand for products that offer greater functionality and faster processing speed while consuming less space has been the mantra driving the electronics industry for many years. Satisfying these objectives have resulted in remarkable improvements in performance and packaging density, but have also created new challenges in managing increasing levels of power as well as resulting heat. Individual processors can draw several hundred watts driving ambient temperatures within the box to levels that can raise serious concerns about system reliability. Closely space daughtercards packed with heat generating devices pose serious challenges to traditional passive and fan based cooling schemes. The semiconductor industry has recognized the threat that power and heat pose to the continuation of Moore' s Law, and are developing new devices that feature reduced power consumption. Multi-core processors for instance can run at slower, less power intensive speeds while increasing processing throughput. Current trends indicate that power reduction at the device level will only slow the overall rate of increase at the system level. The need for efficient power distribution in this environment is having a significant impact on the design and application of connectors for next generation equipment.
Table of Contents
Preface
Chapter 1 - Report Scope and Methodology
- Report Objectives
- Methodology And Approach
- Data Collection Forms
- Power Connector Survey 2007 Update form - Manufacturer
- Power Connector Survey 2007 Update Form - Users
Chapter 2 - Introduction and Definitions
- Introduction
- Connector Definitions And Technologies
- The Anatomy Of A Power Contact
- Basic Power Connector Performance Measurement Criteria
- Hot Swap Feature
- Power Distribution Systems
Chapter 3 - Power Connector Categories
- Defining Characteristics
- Electrical Power Capacity
- Application Configuration
- Connector Form Factor
- Circular
- Rectangular
Chapter 4 - Power Connector Performance
- Power Connector Performance
- Inductance - A New Criterion?
- Contacts In Parallel
- Power Rating Of A Plated Through Hole
- Power Rating Trends
- Pushing The Power Rating
Chapter 5 - Power Connector Standards
- Power Connector Standards
- The SSI Specification
- ATCA, Compact PCI Express
- MicroTCA
- VITA 41/46
Chapter 6 - Power Demand Drivers
- Power Demand Drivers
- Semiconductor Industry Trends
- Power / Heat Connector Impact
- Thermal Management
- Thermal Prediction Tools
- Evolving Power Connector Solutions
Chapter 7 - Connector Failures
- Power Connector Failure Mechanisms
- Keys To Minimizing Power Connector Failures
Chapter 8 - Overview of Current Power Connectors
- Overview Of Current Power Connectors
- Amphenol
- Anderson Power Products
- FCI Electronics
- Hypertronics Corporation
- Molex Incorporated
- Product Current Rating
- Positronic Industries
- Tyco Electronics
- Additional Power Connector Suppliers
- Cableco Technologies Corporation
- Fusionlug
- Power Interconnect Modular System
- CONEC
- ERNI Electronics
- HARTING
- Foxconn
- Hirose
- HIPO Systems
- Flat Power
- Onanon
- Samtec
- Winchester Electronics
Chapter 9 - Power Connector Market Statistics
- World Power Connector Market Computer And Communications Equipment
- Computer/Peripheral Telecom/Datacom Market Forecast
- Forecast by Region Of The World
- North America
- Europe
- Japan
- China
- Asia/Pacific
- ROW
