INTRODUCTION
The nondestructive testing (NDT) industry continues to change. The core NDT technologies are evolving in important ways and the applications in which NDT is used are also changing rapidly. Many of the industries that have traditionally used NDT techniques continue to stagnate or decline, while other industries that have only recently begun to use NDT techniques are expanding. In addition, a wave of consolidations and mergers is still affecting the NDT industry.
The NDT techniques expected to experience the fastest growth over the next five years are x-ray radiography and infrared and thermal imaging. The major reason for growth in the radiography technology markets is the increased emphasis on homeland security issues and combating terrorism.
While most NDT techniques are experiencing various levels of growth, film-based radiographic testing, liquid penetrant, and magnetic particle testing are expected to continue their long-term decline. These techniques do not easily lend themselves to automation or computerization, causing many end users to abandon the techniques in favor of others, such as eddy current, ultrasound, real time radiography or infrared. Overall, the field of NDE is in a mature stage and plays a significant role in our manufacturing economy.
The research and development in materials science, computers, electronics, automation and related fields continue to reshape the nondestructive testing industry. The drive to integrate several nondestructive testing methods will continue. The companies remaining in the NDT industry are making nondestructive technology their prime focus and are enhancing their market position through mergers and acquisitions. These companies are expected to incorporate technology such as telerobotics, wireless communications, neural networks, and use of the Internet into their future products. Such features will enable remote monitoring where centrally located know-how, database, analytical software and decision-making criteria, etc. will be available to the inspectors.
Of all end-user markets, transportation security or cargo and baggage inspection-as a defense in the area of homeland security-are expected to lead the increase in demand for NDT equipment over the next five years. The participants in this market use x-ray technology, and further developments and combination uses with other technologies can be expected in this area. Infrared and thermal imaging techniques also constitutes a significant market for NDT testing. Electronic manufacturers, in particular, are expressing strong demand for nondestructive inspection equipment, such as radioscopy, infrared, and acoustic imaging systems that can be integrated into production lines for quality assurance purposes. The use of visual and optical inspection technology is projected to grow at a measurable rate because of the needs of electronic products manufacturing. Additionally, the manufacturing plants will continue to use eddy current and ultrasonic NDT equipment as a key component in maintenance programs designed to reduce plant shutdowns, operating costs and process control aimed at producing consistent quality. The companies participating in the NDT market will continue to develop smaller and smarter instruments and systems. The user friendliness and high speed will be the major features of these new products.
This review is one of the few to detail new, emerging NDT technologies in the context of the overall nondestructive testing market. This review gives readers an opportunity to learn about extremely up-to-date, cutting-edge technologies. In addition, the latest business developments and company changes have been included in this publication, giving readers an up-to-the-minute perspective on the market.
As a manager or administrator of nondestructive testing, you will be kept up to date on developments in:
- Ultrasonics
- Infrared
- Software
- Radiology
- Acoustics
- Optical
- Eddy currents
- Standards
- Regulations
TABLE OF CONTENTS
INTRODUCTIONACOUSTICS
- PIPELINE INSPECTION TOOL INTROS
- KEITHLEY RECEIVES INNOVATION AWARDS
- KEITHLEY AWARD IN MEASUREMENT
- KEITHLEY AWARD IN MEASUREMENT (CONTINUED)
- KLA-TENCOR RECEIVES TRAINING AWARD
- KEITHLEY BAGS INNOVATION AWARDS
- INVISION BAGS FORTUNE AWARD
- KEITHLEY GETS INNOVATION AWARD
- KEITHLEY PUBLISHES 2004 T&M CATALOG
- AMETEK U.S. GAUGE OFFERS PRODUCT CATALOG
- LEVEL MEASUREMENT CAPABILITIES GUIDE
- MILLTRONICS MONITORS TALK TO INDUSTRIAL BUSES
- DUAL PROBE CONTROL SYSTEM
- PROBE UPDATE FROM TSC INSPECTION
- PHASEC 2D EC INSPECTION
- RADAR ACCESSORIES OPTIMIZE LEVELS
- COST-EFFECTIVE LEVEL MEASUREMENT
- LEPTO-PEN GAUGES COATING THICKNESS
- 40GHZ PARAMETRIC TESTER OFFERED
- 40GHZ PARAMETRIC TESTER OFFERED (CONTINUED)
- RADIO WAVES DETECT MOISTURE IN WALLS
- ACFM RAIL TRACK INSPECTION
- ACFM RAIL TRACK INSPECTION (CONTINUED)
- ACFM RAIL TRACK INSPECTION (CONTINUED)
- U.S. SALES OF NDT SYSTEMS TO REACH $1.77 BILLION BY 2008
- Table 1 U.S. SALES OF NDT SYSTEMS, THROUGH 2008 ($ MILLIONS)
- WORLDWIDE MEM/MST MARKET TO CROSS $26 BILLION BY 2007
- WORLDWIDE MEM/MST MARKET TO CROSS .. (CONTINUED)
- WORLDWIDE MEM/MST MARKET TO CROSS $26 BILLION BY 2007
- Table 2 WORLDWIDE UNIT & DOLLAR SALES OF MEMS/MST PRODUCTS, THROUGH 2007 (MILLIONS)
- HONG KON ORDERS AS&E SYSTEM
- ELBIT ESTABLISHES PRESENCE IN CHINA
- UPDATE ON VEECO/FEI MERGER ANNOUNCEMENT
- FLIR RECEIVES SCANDINAVIA ORDERS
- THERMO-ELECTRON UNITES LASERS AND PHOTONICS OFFERINGS
- VARIAN ACQUIRES MRW GmbH
- ZYGO RECEIVES CONTRACT EXTENSION
- PAL SIGNS PACT WITH CAN
- THERMA-WAVE SELECTED BY TOKYO ELECTRON
- RUDOLPH SELECTED FOR INTEGRATED METROLOGY
- ADE WINS JAPANESE ORDERS
- AMETEK ACQUIRES AIRTECHNOLOGY HOLDINGS
- CONGRESSMAN ATTENDS AS&E ROUNDTABLE
- AS&E CEO ADDRESSES PORT SECURITY CONFERENCE
- AS&E CEO ADDRESSES PORT SECURITY CONFERENCE (CONTINUED)
- FEI GAINS FIRST VECTRA 986+ ORDERS
- VEECO FEI NOT TO MERGE
- INVISION RECEIVES U.S. EDS CONTRACT
- QUANTUM AWARDED $3.49M FROM DOD
- VEECO, SEMATECH WORK ON PHOTOMASKS
- VEECO, SEMATECH WORK ON PHOTOMASKS (CONTINUED)
- RVSI FACILITIES TO CONSOLIDATE
- VEECO RECEIVES MBE ORDERS
- EVEREST VIT CERTIFIED FOR F100 ENGINES
- AGFA-GEVAERT DISINVESTS ITS NDT GROUP
- n&k TO DELIVER SYSTEMS TO SELETE
- ADE RECEIVES MULTIPLE ORDERS
- AS&E GETS $6M AWARD
- EVS INSPECTION SYSTEMS FOR CHINA
- FEI OPENS FACILITY IN CZECH REPUBLIC
- FLIR TEAMS WITH VISTASCAPE
- FLIR TEAMS WITH VISTASCAPE (CONTINUED)
- INVISION TO ACQUIRE YXLON
- INVISION TO ACQUIRE YXLON (CONTINUED)
- PPT OEM AGREEMENT WITH ISMECA
- PPT VISION ANNOUNCES NEW DISTRIBUTOR
- JAPANESE SELECT VEECO METROLOGY TOOL
- VEECO RECEIVES MBE ORDERS
- ZYGO BAGS CONTRACT FROM LLNL
- CORRPRO SELLS BASS-TRIGON ASSETS
- COGNEX ACQUIRES SIEMENS ID BUSINESS
- FLIR IMAGERS TO BE USED IN OLYMPICS
- INVISION BAGS INTERNATIONAL ORDERS
- INVISION COMPLETES YXLON ACQUISITION
- KLA-TENCOR OPENS TAIWAN CENTER
- KLA-TENCOR SHIPS 100TH 300-MM SYSTEM
- KLA-TENCOR SHIPS 100TH 300-MM SYSTEM (CONTINUED)
- CUSTOMS SERVICE ORDERS ARACORS SYSTEMS
- VEECO OPENS SHANGHAI OFFICE
- VEECO LAUNCHES INTEGRATION CENTER
- ZYGO EYES DEFENSE, AEROSPACE
- EVEREST VIT GETS RVI RENEWAL
- MATECH GOES INTERNATIONAL
- CORRPRO TO SELL ROHRBACK COSASCO
- COGNEX EXPANDS IN MACHINE VISION
- AS&E GETS DOD ORDER
- FEI ANNOUNCES ORDERS FOR TEM
- 3-D METROLOGY FOR THIN-FILM HEADS
- KEITHLEY AUTOMATES DIAGNOSTIC TESTS
- ORDERS FOR BUMPED WAFER INSPECTION
- USDATA, RVSI FORM ALLIANCE
- SEMATECH INSTALLS VEECOS AFM
- GE SUED OVER PANAMETRICS ACQUISITION
- GE SUED OVER PANAMETRICS ACQUISITION (CONTINUED)
- TRENCH MEASUREMENT SYSTEMS
- COGNEX TO AWARD CONTINUING EDUCATION
- NEW INTERIM CEO FOR AS&E
- DOD ORDERS MORE MOBILESEARCH SYSTEMS
- RADIOACTIVE THREAT DETECTION ADDED
- NEW COO FOR FEIC
- ARMY AWARDS CONTRACT TO FLIR
- LOGAN AIRPORT ADDS SECURITY
- LOGAN AIRPORT ADDS SECURITY (CONTINUED)
- CAMERAS HELP COMBAT SARS
- INVISION INVESTS IN SAFEVIEW
- MINE DETECTION DEVELOPMENT AWARD
- INVISION RECEIVES INTERNATIONAL ORDERS
- RVSI GETS ASIAN ORDERS
- ADE RECEIVES MULTIPLE ORDERS
- TURKISH FABRIC FIRM SELECTS EVS
- FEI RECEIVES NEW ORDERS
- RVSI GETS WS-3000 ORDER
- CORRPRO SELLS ASIAN OPERATION
- FLIR TOPS NORTHWEST COMPETITION
- WESDYNE NDE SERVICES
- ADE RECEIVES LARGE ORDER
- COGNEX EXPANDS INTO CHINA
- FEI MAKING STRATEGIC ACQUISITIONS
- INVISION SELLS 1,000TH EDS
- JMAR DUMPS PRECISION EQUIPMENT
- RVSI GETS VISIONSCAPE ORDER
- SEMICONDUCTOR PACKAGE SINGULATION INSPECTION
- RVSI RECEIVES ORDERS FOR SCANNERS
- AMETEK ACQUIRES CHANDLER INSTRUMENTS
- KLA-TENCOR WINS EXCELLENCE AWARD
- KLA-TENCOR WINS EXCELLENCE AWARD (CONTINUED)
- MARITIME THERMAL IMAGING SYSTEMS
- AS&E ACHIEVES ISO 9001:2000
- AVIATION SECURITY GROUP AT INVISION
- YXLON ACQUIRES CT SYSTEMS PROVIDER
- KEITHLEY, ZYVEX IN MARKETING AGREEMENT
- TOSHIBA SELECTS KEITHLEY TEST SYSTEM
- NEW GERMAN AMETEK DISTRIBUTOR
- AS&E PRESENTS AT MARITIME EXPO
- FEI OPENS NEW CAMPUS
- FLIR AND INDIGO TO MERGE
- THERMO SELLS T&M BUSINESS
- AMD AWARDS KLA-TENCOR
- INVISION IN DELOITTES TOP 5000
- VARIAN ACQUIRES ZMED TECHNOLOGY
- ROSEN RECEIVES LARGE CONTRACT
- CONDITIONAL APPROVAL OF GE AGFA PURCHASE
- KLA-TENCOR OPENS JAPAN CUSTOMER CENTER
- PPT REGAINS NASDAQ COMPLIANCE
- COGNEX SHIPS 200,000TH SYSTEM
- RVSI FILES AMENDED SEC DOCUMENTS
- VEECO BUYS EMCORES TURBODISC
- VEECO BUYS EMCORES TURBODISC (CONTINUED)
- VEECO PURCHASES ADVANCED IMAGING
- VEECO PURCHASES ADVANCED IMAGING (CONTINUED)
- LANGLEY PROBES SCANNING THERMOGRAPHY
- ADVANCES IN THERMAL SENSING
- CAMERA WITH FIREWIRE OPTION
- CONTRACT FOR HANDHELD CAMERAS
- AIRBORNE IR SENSING TECHNOLOGY
- AIRBORNE IR SENSING TECHNOLOGY (CONTINUED)
- HANDHELD E-SERIES CAMERAS
- BENCHTOP NIR ANALYZER
- TINY CAMERA FOR UAVs
- INDIGO SYSTEMS INTRODUCES VisGaAs
- SPEED CONTROL INSPECTION TOOL
- SPEED CONTROL INSPECTION TOOL (CONTINUED)
- SPEED CONTROL INSPECTION TOOL (CONTINUED)
- KEITHLEY DEVELOPS NANOTECHNOLOGY SOLUTIONS
- U.S. SPECTROSCOPY MARKET TO REACH $4.3 BILLION BY 2007
- U.S. SPECTROSCOPY MARKET .. (CONTINUED)
- Table 3 U.S. MARKET FOR SPECTROSCOPY, THROUGH 2007 ($ MILLIONS)
- SHEAROGRAPHIC SYSTEM FOR COMPONENTS
- ULTRASONIC INSPECTION OF ADHESIVE BONDS
- NDT OF TEA FERMENTATION
- ULTRALOW NOISE ULTRASOUND ELECTRONICS
- HOW GRAIN SIZE INFLUENCES ULTRASONICS
- X-RAY MICRO-TOMOGRAPHY
- ULTRASONIC INSPECTION OF TRAIN WHEELS
- IR THERMOGRAPHY FOR NDT OF BRIDGES
- COMPUTER VISION INSPECTS FOOD
- ULTRASONIC NDT OF ROCK BOLTS
- PLATE DETECTOR FOR RADIOGRAPHY
- IN SITU RELIABILITY MEASUREMENTS
- DEPOSITING NANOPARTICLES ON SEMICONDUCTORS
- DEPOSITING NANOPARTICLES ON SEMICONDUCTORS (CONTINUED)
- 3-D CHIP WITH FOUR WAFERS
- LASER TECHNIQUE DETECTS CAVITIES
- IR SPECTROSCOPY SCREENS MEAT
- IR SPECTROSCOPY SCREENS MEAT (CONTINUED)
- HOLOGRAPHIC TECHNIQUE MEASURES VIBRATION
- IMAGING SUBSURFACE MICROSCOPIC DEFECTS
- TESTING COMPOSITE MILITARY MATERIALS
- TESTING COMPOSITE MILITARY MATERIALS (CONTINUED)
- NDT METHODS FOR SHUTTLE COMPOSITES
- NDT METHODS FOR SHUTTLE COMPOSITES (CONTINUED)
- FINDING DEFECTS IN SMALLEST SCALES
- FINDING DEFECTS IN SMALLEST SCALES (CONTINUED)
- MICROWAVE TESTING OF SHUTTLE INSULATION
- TERAHERTZ TECHNIQUE FOR SHUTTLE DEFECTS
- MOBILE ROBOTS INSPECT GAS PIPES
- MOBILE ROBOTS INSPECT GAS PIPES (CONTINUED)
- CORROSION INHIBITORS AS PENETRANT DYES
- USING CD PLAYERS TO SCREEN MOLECULES
- USING CD PLAYERS TO SCREEN MOLECULES (CONTINUED)
- MEASURING FEATURES BY COUNTING ATOMS
- DUAL MICROSCOPES FOR SPOT DEFECTS
- DETECTING BIOLOGICAL WARFARE SENSORS
- DETECTING BIOLOGICAL WARFARE SENSORS (CONTINUED)
- WEARABLE COMPUTERS TO DETECT CORROSION
- WEARABLE COMPUTERS TO DETECT CORROSION (CONTINUED)
- X-RAY INSPECTION MEETS CHIP-MAKING
- AUTOMATED SENSOR NETWORK FOR DISASTERS
- AUTOMATED SENSOR NETWORK FOR DISASTERS (CONTINUED)
- AUTOMATED SENSOR NETWORK FOR DISASTERS (CONTINUED)
- FILM INSPECTION, FLATNESS SYSTEM
- COGNEX INSPECTION SYSTEM IMPROVED
- 4TH-GENERATION SUPER CCD
- 4TH-GENERATION SUPER CCD (CONTINUED)
- MEMS MEASUREMENT WITH OPTICAL PROFILER
- TableTOP UNIT FOR 3-D INSPECTION
- UV CAMERA INSPECTS ICs
- JET ENGINE INSPECTION SYSTEM
- KLA-TENCOR, MITSUBISHI EVALUATE OVERLAY
- LIVE FIBER DETECTOR
- FLATNESS METROLOGY TOOL DEBUTS
- IC INSPECTION BOTTLENECK BROKEN
- IC INSPECTION BOTTLENECK BROKEN (CONTINUED)
- AUTOMATIC 3-D INSPECTION SYSTEM
- HIGH-SPEED INDUSTRIAL CAMERA
- HIGH-SPEED INDUSTRIAL CAMERA (CONTINUED)
- VIDEOSCOPE KEEPS THE BORDER SECURE
- REMOTE VIDEO INSPECTION SYSTEMS
- DIGITAL CMOS VISION CAMERA
- DIGITAL CMOS VISION CAMERA (CONTINUED)
- HIGH-PERFORMANCE FRAME GRABBERS
- PROCESS WINDOW QUALIFICATION
- PROCESS WINDOW QUALIFICATION (CONTINUED)
- COSMETIC MAKER SELECTS COGNEX
- OPTICAL THIN-FILM METROLOGY SOLUTION
- OPTICAL THIN-FILM METROLOGY SOLUTION (CONTINUED)
- RETICLE INSPECTION FOR SUB-90-NM ICS
- INLINE FOCUS-EXPOSURE MONITORING FOR LITHOGRAPHY
- INLINE FOCUS-EXPOSURE MONITORING .. (CONTINUED)
- BRIGHTFIELD ILLUMINATION TO CAPTURE DEFECTS
- BRIGHTFIELD ILLUMINATION TO CAPTURE DEFECTS (CONTINUED)
- LAND GRID ARRAY SOCKET INSPECTION
- METROLOGY OF STRAINED SILICON
- AUTOMATED STEEL QUALITY INSPECTION
- CORECO PARTNERS WITH TELI
- LOW-COST MACHINE VISION SYSTEM
- IMPROVEMENTS IN LEAD SCANNERS
- IMPROVEMENTS IN LEAD SCANNERS (CONTINUED)
- WAFER INSPECTION SYSTEM IMPROVED
- MEMS METROLOGY TOOL DEBUTS
- COGNEX CHOSEN BY STEEL PRODUCER
- METROLOGY SOLUTION FOR 90-NM NODE
- METROLOGY SOLUTION FOR 90-NM NODE (CONTINUED)
- KLA TEAMS WITH CARL ZEISS
- KLA TEAMS WITH CARL ZEISS (CONTINUED)
- IMAGE MANAGEMENT FOR REMOTE OPERATION
- CD METROLOGY FOR MASKS AND RETICLES
- INSPECTION SYSTEM SAVES TIME
- MORE ORDERS FOR 200MM MEASUREMENT
- METAL FILMS METROLOGY
- LS-8000 LEAD SCANNER
- CAMERA INTERFACE FOR VISIONSCAPE
- CAMERA INTERFACE FOR VISIONSCAPE (CONTINUED)
- HIGH PERFORMANCE MACHINE VISION
- VIDEO BORESCOPE SYSTEM INTROS
- 300-MM SYSTEM METROLOGY
- COGNEX LAUNCHES VISION INTEGRATOR PROGRAM
- LIMITS IN GEOMETRIC PATTERN MATCHING
- COGNEX INSPECTION PROOF IN PACKAGING
- COGNEX INSPECTION PROOF IN PACKAGING (CONTINUED)
- IMPACT MACHINE-VISION MICRO-SYSTEM
- NETWORKED VISION SMART CAMERAS
- NETWORKED VISION SMART CAMERAS (CONTINUED)
- PARTNERSHIP FOR WAFER METROLOGY
- MACHINE VISION FACTORY AUTOMATION
- OPTICAL DIGITAL PROFIOMETRY
- ADE INTROS WAFER SURFACE INSPECTION
- OVERLAY METROLOGY SOLUTION FOR 65-NM NODE
- OVERLAY METROLOGY SOLUTION FOR 65-NM NODE (CONTINUED)
- MACHINE VISION LENS
- COST-EFFECTIVE PACKAGE TESTING
- METHOD FOR DIGITAL IMAGING
- LOOKING AT FERROUS METALS
- NEW APPLICATIONS
- APPROVED PATENTS
- TESTING FOR STRUCTURE DEFECTS
- TAKING A CLOSE LOOK AT STEEL
- EUROCOPTER CHOOSES RADVIEW
- VARIAN EXHIBITS SECURITY PRODUCTS
- STANFORD ESTABLISHES NANOCHARACTERIZATION FACILITY
- PORTABLE X-RAY UNIT OFFERED
- CHARACTERISTICS
- SPECIAL FEATURES
- INSPECTING ALUMINUM VEHICLE WHEELS
- SUB-100-NM CRITICAL DIMENSION METROLOGY
- POSITRON SYSTEM GETS SBIR AWARD
- POSITRON SYSTEM GETS SBIR AWARD (CONTINUED)
- FEI LAUNCHES A 90-NM NODE
- FEI LAUNCHES QUANTA SEM
- JMAR TO DEVELOP MONITORING TECHNOLOGY
- MOBILE X-RAY INSPECTION
- TYPICAL CHARACTERISTICS
- SPECIAL FEATURES
- X-RAY SCREENING VAN SYSTEM
- WEAPONS DETECTION USING TERAHERTZ RADIATION
- RADIATION DETECTION TECHNOLOGY
- AS&E INSPECTION SYSTEM FOR SINGAPORE
- AS&E INSPECTION SYSTEM FOR SINGAPORE (CONTINUED)
- CHARACTERIZATION, REPAIR OF PHOTOLITH MASKS
- E-BEAM INSPECTION SYSTEM UNVEILED
- E-BEAM INSPECTION SYSTEM UNVEILED (CONTINUED)
- REAL-TIME IN-FAB METROLOGY SYSTEM
- REAL-TIME IN-FAB METROLOGY SYSTEM (CONTINUED)
- BETTER MATERIAL ANALYSIS USING SPMs
- DUALBEAM SYSTEMS FAMILY INTROS
- DUALBEAM SYSTEMS FAMILY INTROS (CONTINUED)
- YXLON SELLS XES EDS
- DIMENSION X ATOMIC FORCE MICROSCOPE
- VX340 ATOMIC FORCE PROFILER
- INVISION GETS MORE EDS ORDERS
- LINATRON CARGO SCREENERS ORDERED
- COMPACT X-RAY INSPECTION SYSTEM
- DETECTING DAMAGE IN NICKEL SUPERALLOYS
- AS&E STRUTS ITS NEW TECHNOLOGY
- AS&E STRUTS ITS NEW TECHNOLOGY (CONTINUED)
- VARIAN PARC TO DEVELOP SECURITY SYSTEM
- SBIR AWARD FOR POSITRON SYSTEMS
- SBIR AWARD FOR POSITRON SYSTEMS (CONTINUED)
- DOD BUYS BACKSCATTER SCREENING SYSTEMS
- NEXT-GENERATION EXPLOSIVES DETECTION
- SEMICON METROLOGY WITH VX 340
- PARIS HIGHLIGHTS BACKSCATTER SYSTEM
- NDT OF SILICON CARBIDE WAFERS
- FATIGUE AND FRACTURE ANALYSIS
- CIMETRIX SELECTED FOR QUICK INTEGRATION
- BATCH TESTER FOR MATERIALS TESTING
- FAB-WIDE YIELD ANALYSIS SOFTWARE
- TRAINING, INSPECTION TOOLS FOR VISIONPRO
- DETECTING AIR LEAKS IN THE SPACE STATION
- DETECTING AIR LEAKS IN THE SPACE STATION (CONTINUED)
- EASE-OF-USE SOFTWARE FOR IN-SIGHT
- IR SOFTWARE MODULES
- APPLICATIONS FOR ULTRASONIC TECHNOLOGY CONTINUE TO EMERGE
- APPLICATIONS FOR ULTRASONIC TECHNOLOGY .. (CONTINUED)
- Table 4 U.S. ULTRASONIC MARKET BY SEGMENT, THROUGH 2008 ($ MILLIONS)
- MOSFET PAIR FOR PULSERS
- 4-CHANNEL PULSER/RECEIVER
- MAIN FEATURES
- PULSER/RECEIVER BOARD FOR PCI BUS
- PULSER/RECEIVER BOARD FOR PCI BUS (CONTINUED)
- PULSER/RECEIVER BOARD FOR PCI BUS (CONTINUED)
- LLOYDS APPROVES MILLTRONICS SYSTEMS
- MILLTRONICS LEVEL DEVICE BAGS AWARD
- DSP EMBEDDED UT BOARD
- R/D TECHS OMNISCAN FAMILY
- CONTINUOUS LEVEL MEASUREMENT
- EPOCH 4 RENEWS OPERATING SOFTWARE
- AUTO-V MODULES FOR UT THICKNESS GAUGE
- CORROSION THICKNESS GAGE
- R&D 100 AWARD FOR PNNL
- FLAW DETECTOR WITH COLOR DISPLAY
- R/D TECH LAUNCHES OMNISCAN
- HOW TO MEASURE THIN PLASTICS
- USM 35 FLAW DETECTOR
- GE PANAMETRICS INTROS EMATs
- MULTIRANGER IN PANEL-MOUNT VERSION
LIST OF TABLES
- Table 1 U.S. SALES OF NDT SYSTEMS, THROUGH 2008 ($ MILLIONS)
- Table 2 WORLDWIDE UNIT & DOLLAR SALES OF MEMS/MST PRODUCTS, THROUGH 2007 (MILLIONS)
- Table 3 U.S. MARKET FOR SPECTROSCOPY, THROUGH 2007 ($ MILLIONS)
- Table 4 U.S. ULTRASONIC MARKET BY SEGMENT, THROUGH 2008 ($ MILLIONS)
