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年間契約型資訊服務 - 209507

氮化鎵(GaN)LED的每季供給報告

Quarterly GaN LED Supply Report

出版商 Strategies Unlimited
出版日期 4 Issues/Year 內容資訊 英文 103 Pages
價格
氮化鎵(GaN)LED的每季供給報告 Quarterly GaN LED Supply Report
出版日期: 4 Issues/Year 內容資訊: 英文 103 Pages
簡介

本年度資訊服務提供,InGaN LED及GaN 關於LED的供給趨勢追蹤調查,以每季為基礎,為您概述為以下內容。

調查內容範例

  • InGaN·GaN LED的供給相關資料(淺藍色·綠色·白色)
  • 以下所包含的特定反應反應器及組成相關資料
    • 維護
    • 磊晶收益率
    • 晶片產量比率
    • 包裝產量比率
    • 標準篩選
    • 工廠使用率的假設等
  • 生產能力(以參數所計算出來的每日生產量為基礎的MOCVD設備的生產能力)
    • 每個磁盤的晶圓數
    • 週期
    • 停機時間
  • 晶粒生產能力(以每天生產量為基礎計算出來)
    • 晶片尺寸
    • 加權平均的晶粒尺寸:不同應用領域
    • 反應器數量
  • 平均運作率·包裝產量比率
  • 2010年第2季的安裝:設備成長型企業及LED製造商數公司的調查
  • 2010年第2季的安裝:設備成長型企業的的出貨實際成果
  • 2010年第3季的安裝:反應器的訂購數量
  • 2010年第四季的安裝:設備成長型企業的生產能力的估計
目錄

This report contains the results of the most comprehensive LED supply model for the LED Industry.

  • The supply data consists of InGaN and GaN LEDs (i.e., blue, green, and white). For the report when GaN is referred to, it also includes InGaN.
  • The analysis consists of specific reactor and configuration data combined with maintenance, epi yield, chip yield, package yield, and in-spec selection as well as factory utilization assumptions to drive the capacity figures.
  • Capacity is defined as the production capability of a MOCVD tool based on the Runs/Day calculated using the following:
    • Parameters
      • Number of wafers per platter
      • Cycle Time
      • Downtime
  • Runs per day is then used to calculate die capacity based on:
    • Wafer Size
    • Weighted Average Die Size by Application
    • Number of Reactors
  • Average Utilization and Package Yield
  • The installations in Q2'10 were determined by surveying tool makers and some LED manufacturers.
  • Q2'10 installations are based on actual shipments by the tool makers and Q3'10 is based on reactor orders. The Q4'10 installations are based on estimating the capacity of the tool makers, assessing their orders and then combining the totals of the tool makers into a single number without considering the LED manufacturer.

Table of Contents

  • Executive Summary
  • Chapter 1 - Metal Organic Chemical Vapor Deposition (MOCVD) Background
  • Chapter 2 - Methodology
  • Chapter 3 - LED Manufacturing - MOCVD
  • Chapter 4 - MOCVD Shipments
  • Chapter 5 - Supply/Demand Analysis
  • Chapter 6 - LED Manufacturers - Wafer Capacity
  • Chapter 7 - LED Manufacturers - Die Capacity
  • Chapter 8 - LED Manufacturers - Yielded Die
  • Chapter 9 - LED Manufacturers - In-spec (Binned) Die
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